Design of anti-mildew microcapsules
Researchers have presented anti-mildew microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating.
Moisture protection, anti-mildew and anti-corrosion are essential to guarantee the normal service of electronic devices. Although epoxy holds great potential for electronic packaging, its inferior anti-corrosive performance and anti-mildew capability significantly affect the lifespan of the coating and thus impede further technological advances in electronic devices. To address this concern, researchers have fabricated environmental-friendly anti-mildew smart microcapsules (MCs) by encapsulating benzotriazole (BTA) loaded halloysite clay nanotubes (HNTs) with chitosan (CTS). The coating presents superior anti-mildew property with 5 wt% MCs addition.
Significantly promoted anti-corrosive performance
Furthermore, the charge transfer resistance of T2 copper beneath the coating is three orders of magnitude larger after 35 days’ immersion, which confirms a significantly promoted anti-corrosive performance for the coating. Moreover, mechanism study shows that such enhanced corrosion protective performance of proposed coating benefits from an excellent self-healing property enabled by a sustainable release of BTA with water and dual-pH sensitivity as well as effective adsorption of BTA on metal surface.
The review has been published in Progress in Organic Coatings, Volume 180, July 2023.
Event tip
Protective coatings are also in the focus of the EC Conference Protective & Fire-retardant Coatings on October 18 -19 in Berlin, Germany. The latest developments in protective and fire-retardant coatings will be presented to you in one conference.
